From Fedora Project Wiki

Line 1: Line 1:
{{Admon/warning | F13 | Beat owner should begin placing Fedora 13 content in this beat. }}
+
{{header|docs}}
 +
{{Admon/warning | Document is Final | The contents of this beat have been sent for translation for the GA version of the Release Notes.  Any additional changes to this beat will not appear until after the release of Fedora 13.  If you have zero-day changes, be sure to post a bug. }}
 +
 
 +
= Circuit Design =
 +
 
 +
Fedora 13 includes a complete set of applications for schematic capture, circuit simulation, and PCB layout. The following are major changes to these applications. A complete list of changes may be found in the Technical Notes available at http://docs.fedoraproject.org.
 +
 
 +
 
 +
== ngspice ==
 +
 
 +
{{Package|ngspice}} and {{Package|tclspice}} have been upgraded to Release 20. New features include .measure command for transient, ac and dc analyses (still not complete, e.g. DERIV is missing). Improved device support incudes an updated BISM4 model to revision 4.6.5. Added PWL (PieceWise Linear) functionality for B (arbitrary generator) sources.
 +
 
 +
 
 +
== pcb ==
 +
 
 +
Fedora 13 includes version 0.20091103 of {{Package|pcb}}. There are a number of new features including the ability to add attributes to layers, to add filters through the load file chooser dialog, allowing quoted and escaped strings, and many new footprints. For a complete list of new features, footprints and bug fixes, refer to the news file at http://pcb.gpleda.org/news.html#20091103.
 +
 
 +
 
 +
== Dia ==
 +
 
 +
A number of digital and electronic symbols have been added to the drawing package, {{Package|dia}}. New packages include {{Package|dia-CMOS}}, {{Package|dia-Digital}}, {{Package|dia-electric2}} and {{Package|dia-electronic}}.
  
  
 
<noinclude>[[Category:Release Notes]]<noinclude>
 
<noinclude>[[Category:Release Notes]]<noinclude>
 
[[Category:Documentation_beats]]
 
[[Category:Documentation_beats]]

Revision as of 15:35, 26 April 2010

DocsProject Header docTeam1.png
Warning.png
Document is Final
The contents of this beat have been sent for translation for the GA version of the Release Notes. Any additional changes to this beat will not appear until after the release of Fedora 13. If you have zero-day changes, be sure to post a bug.

Circuit Design

Fedora 13 includes a complete set of applications for schematic capture, circuit simulation, and PCB layout. The following are major changes to these applications. A complete list of changes may be found in the Technical Notes available at http://docs.fedoraproject.org.


ngspice

Package-x-generic-16.pngngspice and Package-x-generic-16.pngtclspice have been upgraded to Release 20. New features include .measure command for transient, ac and dc analyses (still not complete, e.g. DERIV is missing). Improved device support incudes an updated BISM4 model to revision 4.6.5. Added PWL (PieceWise Linear) functionality for B (arbitrary generator) sources.


pcb

Fedora 13 includes version 0.20091103 of Package-x-generic-16.pngpcb. There are a number of new features including the ability to add attributes to layers, to add filters through the load file chooser dialog, allowing quoted and escaped strings, and many new footprints. For a complete list of new features, footprints and bug fixes, refer to the news file at http://pcb.gpleda.org/news.html#20091103.


Dia

A number of digital and electronic symbols have been added to the drawing package, Package-x-generic-16.pngdia. New packages include Package-x-generic-16.pngdia-CMOS, Package-x-generic-16.pngdia-Digital, Package-x-generic-16.pngdia-electric2 and Package-x-generic-16.pngdia-electronic.